![\"\"](\"https:\/\/meetings.informs.org\/wordpress\/wsc2020\/files\/2020\/02\/img_chenFu_chien.jpg\")
<\/a><\/p>\nChen-Fu Chien, Ph.D. The 2020 International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) aims to again be a forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world involved in modeling and analysis of complex high-tech manufacturing systems.<\/strong> We are convinced of the worth and importance of the continuation of the MASM events held in Tempe, Arizona in 2000 and 2002, Singapore in 2005, Miami, Florida in 2008, Austin, Texas in 2009, Baltimore, Maryland in 2010, Phoenix, Arizona in 2011, Berlin, Germany in 2012, Washington, DC in 2013, Savannah, Georgia in 2014, Huntington Beach, California in 2015, Washington, DC in 2016, Las Vegas, Nevada in 2017, Gothenburg, Sweden in 2018, National Harbor, Maryland in 2019.<\/p>\n The MASM 2020 conference will be fully contained within the Winter Simulation Conference 2020 (WSC 2020), the leading conference in discrete-event simulation. <\/strong>However, MASM 2020 covers a much wider range of techniques and approaches than simulation (e.g. optimization, scheduling, queueing theory, process control, data analysis, machine learning).<\/em> WSC 2020 features a comprehensive program ranging from introductory tutorials to state-of-the-art research and practice. WSC 2020 will take place in Orlando, Florida. All attendees of the MASM conference will register for WSC 2020 at the same cost. All participants of WSC 2020 can attend MASM 2020 sessions.<\/p>\n We are looking for high-quality academic and applied research at all levels of semiconductor manufacturing.<\/strong><\/p>\n We invite participants to present on all topics related to modeling and analysis that will help address these challenges. We also welcome contributions that integrate decisions or information at different decision levels, which is becoming a must. These various goals will be attained through new advanced control and statistical methods, novel computing techniques, methods from artificial intelligence, and operations research methods. While the MASM conference is mostly focused on the current semiconductor industry state-of-the-art, neither presenters nor attendees need to be in the IC industry to participate. We are interested in methodologies, research and\/or applications from other related industries such as TFT-LCD, flexible displays, bio-chip, solid state lighting (LED), and photovoltaic (PV) that might also share or want to share common and new practices.<\/p>\n Authors of high-quality submissions will have the opportunity to submit consi\u00adderably extended versions of their MASM contributions to IEEE Transactions on Semiconductor Manufacturing.<\/p>\n The conference includes tutorials and related software demonstrations within the Winter Simulation Conference 2020. A broad range of papers is sought, including theoretical developments, applied research, and case studies. Interested individuals within academia, government agencies, equipment suppliers, manufacturers, students, contractors, and other interested parties are encouraged to participate.<\/p>\n MASM 2020 will feature a keynote talk by Professor Chen-Fu Chien who is the Tsinghua Chair Professor & Micron Chair Professor in the Department of Industrial Engineering & Engineering Management at National Tsing Hua University in Taiwan.<\/p>\n John W. Fowler, Arizona State University, USA Jakey Blue, National Taiwan University, Taiwan Please follow the WSC 2020 Author Kit to prepare your MASM 2020 paper at http:\/\/www.wintersim.org<\/a>.<\/p>\n Deadline for Paper Submission: April 3<\/p>\n Notification of Acceptance: May 29<\/p>\n Camera Ready Paper due: June 30<\/p>\n MASM 2020 will be held in Orlando, Florida December 8-11, 2020. The Orlando World Center Marriott is the host hotel for WSC 2020. Please check the web site http:\/\/www.wintersim.org<\/a> to get more information and reserve rooms at conference rates.<\/p>\n
<\/strong>Tsinghua Chair Professor & Micron Chair Professor
<\/strong>Department of Industrial Engineering & Engineering Management
<\/strong>National Tsing Hua University, Hsinchu 30013, Taiwan<\/strong><\/p>\n\n
Conference Organizers<\/h4>\n
Michael Hassoun, Ariel University, Israel
Lars M\u00f6nch, University of Hagen, Germany<\/p>\nInternational Program Committee (to be confirmed)<\/h4>\n
Chen-Fu Chien, National Tsing-Hua University, Taiwan
You-In Choung, SK Hynix, Republic of Korea
St\u00e9phane Dauz\u00e8re-P\u00e9r\u00e8s, Ecole des Mines de Saint-Etienne, France
Hans Ehm, Infineon, Germany
Ken Fordyce, Arkieva, USA
Cathal Heavey, University of Limerick, Republic of Ireland
Jesus Jimenez, Texas State University, USA
Myoungsoo (Andy) Ham, Liberty University, USA
Baris Kacar, SAS, USA
Adar Kalir, Intel, Israel
Hyun-Jung Kim, KAIST, Republic of Korea
Andreas Klemmt, Infineon, Germany
Tae-Eog Lee, KAIST, Republic of Korea
Peter Lendermann, D-SIMLAB, Singapore
John Milne, Clarkson University, USA
James Morrison, Central Michigan University, USA
Irfan Ovacik, Intel, USA
Detlef Pabst, Global Foundries, USA
Thomas Ponsignon, Infineon, Germany
Oliver Rose, Universit\u00e4t der Bunderwehr M\u00fcnchen, Germany
Ralf Sprenger, Infineon, Germany
Marcel Stehli, Global Foundries, Germany
Gian Antonio Susto, University of Padova, Italy
Reha Uzsoy, North Carolina State University, USA
Kan Wu, Nanyang Technological University, Singapore
Jei-Zheng Wu, Soochow University Taipei, Taiwan
Claude Yugma, Ecole de Mines de Saint-Etienne, France<\/p>\nPaper Submission<\/h2>\n
Important Dates<\/h4>\n
Conference Location<\/h4>\n