{"id":4423,"date":"2017-01-18T15:45:01","date_gmt":"2017-01-18T15:45:01","guid":{"rendered":"https:\/\/meetings.informs.org\/wordpress\/meetings2-2\/?page_id=4423"},"modified":"2023-02-10T19:12:30","modified_gmt":"2023-02-10T19:12:30","slug":"masm","status":"publish","type":"page","link":"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/masm\/","title":{"rendered":"Modeling and Analysis of Semiconductor Manufacturing"},"content":{"rendered":"\n
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19th International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) 2023<\/h2>\n

San Antonio, TX
December 10-13, 2023<\/h3>\n

Part of Winter Simulation Conference (WSC) 2023<\/strong><\/p>\n

The International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) is an annual forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world involved in modeling and analysis of complex high-tech manufacturing systems.<\/p>\n

The MASM Conference is fully contained within the Winter Simulation Conference (WSC), the world-leading conference for Discrete Event Simulation, but covers a much wider range of techniques and approaches that also include optimization, scheduling, queueing theory, process control, data analysis and machine learning. It features a comprehensive program ranging from state-of-the-art research to recent case studies demonstrating the relevance of these techniques for Smart Manufacturing.<\/p>\n

For 2023 we are asking not just for Full Research Papers but also for relevant Industrial Case Studies illustrating the benefits that have been achieved with novel methodologies and solutions. These Industrial Case Study presentations will be fully integrated into the respective MASM application track but will only require a 3-page \u201cExtended Abstract\u201d and have shorter submission lead times to facilitate participation from the industry. Unlike Full Research Papers, Extended Abstracts will appear only in the INFORMS Simulation Society archives but not in the ACM and IEEE digital proceedings.<\/p>\n

The MASM 2023 conference will take place in San Antonio, Texas. San Antonio and nearby Austin are home to many players of the semiconductor and electronics supply chain. The San Antonio Marriott Rivercenter is located on the beautiful waterfront within walking distance of historical sites.<\/p>\n

We are looking for high-quality academic and applied research and relevant industrial case studies at all levels of Semiconductor Manufacturing.<\/p>\n

At the equipment and process level, we would like to cover various aspects of Equipment Maintenance and Productivity, Quality and Advanced Process Control (Statistical Process Control, Fault Detection and Classification, Run To Run, Virtual Metrology, etc.), but also how to handle and exploit the huge amount of data generated in wafer fabs (Big Data). As such we also invite submissions from leading Semiconductor Equipment Manufacturers.<\/p>\n

At the shop-floor level, optimized WIP management, dispatching, scheduling and sampling of lots or qualification management of products on machines remain critical in particular when handling complex constraints.<\/p>\n

At the factory level, it is important to develop efficient transportation and storage policies, production and capacity planning approaches, in order to reduce cycle times and time-to-market.<\/p>\n

At the strategic level, demand planning, factory economics and cost modeling, new product introduction, and supply chain efficiency are important topics to support the business.<\/p>\n

We invite participants to present on all topics related to modeling and analysis that will help address these challenges. We also welcome contributions that integrate decisions or information at different decision levels which is becoming a must. These various goals will be attained through new advanced control and statistical methods, novel computing techniques, methods from artificial intelligence, and operations research methods.<\/p>\n

While the MASM Conference is mostly focused on the current semiconductor industry state-of-the-art, neither presenters nor attendees need to be in the IC industry to participate. We are interested in methodologies, research and\/or applications from other related industries such as TFT-LCD, flexible displays, bio-chip, solid state lighting (LED), and photovoltaic (PV) that might also share or want to share common and new practices. Interested individuals within academia, government agencies, equipment suppliers, manufacturers, students, contractors, and other interested parties are encouraged to participate.<\/p>\n

All attendees of the MASM Conference will register for Winter Simulation Conference at the same cost. In turn, all participants of WSC can attend the respective MASM sessions.<\/p>\n

Each accepted paper and case study presentation must have a separate, paid registration. Only under highly unusual circumstances, and at the discretion of the conference leadership, will an author be allowed to present more than one paper on a single registration. Authors wishing to do so must contact the Program Chair by September 1, clearly describing which papers the authors wish to present under the single registration, and why an exception to the conference policy is warranted. Unless permission is granted, an author planning to present two papers will be required to pay for two registrations.<\/p>\n

Authors of high-quality submissions of Full Research Papers will also have the opportunity to submit considerably extended versions of their MASM contributions to IEEE Transactions on Semiconductor Manufacturing<\/em>.<\/p> <\/div>\n<\/div>\n <\/div>\n

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Important Dates<\/h2>\n

Full Research Papers:<\/h3>\n

Immediately:<\/strong> <\/span>Submission open<\/p>\n

April 7, 2023:<\/strong><\/span> Submission due<\/p>\n

April 28, 2023:<\/strong><\/span> Submission due for invited papers<\/p>\n

June 2, 2023:<\/strong><\/span> Notification of acceptance<\/p>\n

July 2, 2023:<\/strong> <\/span>Camera-ready paper due<\/p>\n

Extended Abstracts for Industrial Case Studies:<\/h3>\n

May 1, 2023:<\/strong><\/span> Submission open<\/p>\n

August 4, 2023<\/strong>:<\/span> Submission due<\/p>\n

September 1, 2023:<\/strong><\/span> Notification of acceptance<\/p>\n

September 15, 2023:<\/strong><\/span> Camera-ready abstract due<\/p>\n

Please follow the\u00a02023 WSC Author Kit<\/a>\u00a0to prepare your MASM 2023 Paper or Extended Abstract.<\/p> <\/div>\n<\/div>\n\n

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Conference Organizers<\/h3>\n

John W. Fowler, Arizona State University, USA
Lars M\u00f6nch, University of Hagen, Germany
Young Jae Jang, KAIST, South Korea<\/p>\n

International Program Committee<\/h3>\n

Jakey Blue, National Taiwan University, Taiwan
Chen-Fu Chien, National Tsing-Hua University, Taiwan
St\u00e9phane Dauz\u00e8re-P\u00e9r\u00e8s, Ecole des Mines de Saint-Etienne, France
Hans Ehm, Infineon Technologies, Germany
Ken Fordyce, Arkieva, USA
Michael Hassoun, Ariel University, Israel
Cathal Heavey, University of Limerick, Ireland
Jesus Jimenez, Texas State University, USA
Myoungsoo (Andy) Ham, Liberty University, USA
Chiang Hsu, TSMC, Taiwan
Baris Kacar, SAS, USA
Adar Kalir, Intel, Israel
DJ Kim, Micron Technology, USA
Hyun-Jung Kim, KAIST, South Korea
Andreas Klemmt, Infineon Technologies, Germany
Tae-Eog Lee, KAIST, South Korea
Peter Lendermann, D-SIMLAB Technologies, Singapore
John Milne, Clarkson University, USA
James Morrison, Central Michigan University, USA
Tina O\u2019Donnell, Seagate Technology, Derry, United Kingdom
Detlef Pabst, Global Foundries, USA
Thomas Ponsignon, Infineon Technologies, Germany
Oliver Rose, Universit\u00e4t der Bundeswehr M\u00fcnchen, Germany
Ralf Sprenger, Infineon Technologies, Germany
Marcel Stehli, Global Foundries, Germany
Gian Antonio Susto, University of Padova, Italy
Reha Uzsoy, North Carolina State University, USA
Philippe Vialletelle, ST Microelectronics, France
Jei-Zheng Wu, Soochow University Taipei, Taiwan
Claude Yugma, Ecole de Mines de Saint-Etienne, France<\/p> <\/div>\n<\/div>\n <\/div>\n <\/div>\n <\/div>\n

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MASM Keynote<\/h3>\n

Hans is Senior Principal Supply Chain of Infineon Technologies AG and is responsible for supply chain innovations. He holds degrees in Physics (Dipl. Ing (FH) HS Munich) from Germany and a Masters degree in Mechanical Engineering from Oregon State University\/ USA. He has almost 40 years of experience in the semiconductor industry, including managing wafer fabrication, assembly & test, and global supply chain operations.<\/p>\n

Hans was on the Supervisory Board of camLine Holding AG, an IT company providing software for supply and quality chains for over ten years until 2020. He was chairman of the European Leadership Team<\/em> of the Supply Chain Council<\/em> and is a past Board Member<\/a> of APICS SCC. He leads the working group (Arbeitskreis) SCM of the ZVEI. He is active in several EU projects like SC\u00b3<\/a> – semantically connected semiconductor supply chains.<\/p>\n

Hans has taught Supply Chain Management and been involved in curriculum development at several universities. In 2015, he was awarded with the renowned LEO-Award<\/a> (Logistics Excellence Optimisation<\/em>) in the category \u201cManager\u201d from DVZ Media Group. SCM Movement listed him as one of the 10 most influential SCM Managers in the DACH region 2018<\/a>.<\/p>\n

Hans is a co-organizer of Dagstuhl Seminar 23362 “Decision-Making Techniques for Smart Semiconductor Manufacturing” scheduled for September 3-8, 2023. He publishes his work see google scholar<\/a> or the Ehm\u2019s lab on Research Gate<\/a>.<\/p> <\/div>\n<\/div>\n <\/div>\n

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\n \"Hans \n <\/div>\n \n \n
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\n Hans Ehm<\/strong>\nSenior Principal Supply Chain<\/strong>\nInfineon Technologies AG<\/strong> <\/div>\n \n <\/div>\n \n <\/div>\n <\/div>\n <\/div>\n <\/div>\n <\/div>\n","protected":false},"excerpt":{"rendered":"

19th International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) 2023 San Antonio, TXDecember 10-13, 2023 Part of Winter Simulation Conference (WSC) 2023 The International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) is an annual forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world […]<\/p>\n","protected":false},"author":1001065,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"class_list":["post-4423","page","type-page","status-publish","hentry","has-post-title","has-post-date","has-post-category","has-post-tag","has-post-comment","has-post-author",""],"acf":[],"yoast_head":"\nModeling and Analysis of Semiconductor Manufacturing - Winter Simulation Conference 2023<\/title>\n<meta name=\"description\" content=\"The 2022 MASM is a forum for exchanging of ideas and industrial innovations in modeling and analysis of complex high-tech manufacturing systems.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/masm\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Modeling and Analysis of Semiconductor Manufacturing\" \/>\n<meta property=\"og:description\" content=\"The 2022 MASM is a forum for exchanging of ideas and industrial innovations in modeling and analysis of complex high-tech manufacturing systems.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/masm\/\" \/>\n<meta property=\"og:site_name\" content=\"Winter Simulation Conference 2023\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-10T19:12:30+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/masm\/\",\"url\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/masm\/\",\"name\":\"Modeling and Analysis of Semiconductor Manufacturing - 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It features a comprehensive program ranging from state-of-the-art research to recent case studies demonstrating the relevance of these techniques for Smart Manufacturing.<\/p> <p>For 2023 we are asking not just for Full Research Papers but also for relevant Industrial Case Studies illustrating the benefits that have been achieved with novel methodologies and solutions. These Industrial Case Study presentations will be fully integrated into the respective MASM application track but will only require a 3-page \u201cExtended Abstract\u201d and have shorter submission lead times to facilitate participation from the industry. Unlike Full Research Papers, Extended Abstracts will appear only in the INFORMS Simulation Society archives but not in the ACM and IEEE digital proceedings.<\/p> <p>The MASM 2023 conference will take place in San Antonio, Texas. San Antonio and nearby Austin are home to many players of the semiconductor and electronics supply chain. The San Antonio Marriott Rivercenter is located on the beautiful waterfront within walking distance of historical sites.<\/p> <p>We are looking for high-quality academic and applied research and relevant industrial case studies at all levels of Semiconductor Manufacturing.<\/p> <p>At the equipment and process level, we would like to cover various aspects of Equipment Maintenance and Productivity, Quality and Advanced Process Control (Statistical Process Control, Fault Detection and Classification, Run To Run, Virtual Metrology, etc.), but also how to handle and exploit the huge amount of data generated in wafer fabs (Big Data). As such we also invite submissions from leading Semiconductor Equipment Manufacturers.<\/p> <p>At the shop-floor level, optimized WIP management, dispatching, scheduling and sampling of lots or qualification management of products on machines remain critical in particular when handling complex constraints.<\/p> <p>At the factory level, it is important to develop efficient transportation and storage policies, production and capacity planning approaches, in order to reduce cycle times and time-to-market.<\/p> <p>At the strategic level, demand planning, factory economics and cost modeling, new product introduction, and supply chain efficiency are important topics to support the business.<\/p> <p>We invite participants to present on all topics related to modeling and analysis that will help address these challenges. We also welcome contributions that integrate decisions or information at different decision levels which is becoming a must. These various goals will be attained through new advanced control and statistical methods, novel computing techniques, methods from artificial intelligence, and operations research methods.<\/p> <p>While the MASM Conference is mostly focused on the current semiconductor industry state-of-the-art, neither presenters nor attendees need to be in the IC industry to participate. We are interested in methodologies, research and\/or applications from other related industries such as TFT-LCD, flexible displays, bio-chip, solid state lighting (LED), and photovoltaic (PV) that might also share or want to share common and new practices. Interested individuals within academia, government agencies, equipment suppliers, manufacturers, students, contractors, and other interested parties are encouraged to participate.<\/p> <p>All attendees of the MASM Conference will register for Winter Simulation Conference at the same cost. In turn, all participants of WSC can attend the respective MASM sessions.<\/p> <p>Each accepted paper and case study presentation must have a separate, paid registration. Only under highly unusual circumstances, and at the discretion of the conference leadership, will an author be allowed to present more than one paper on a single registration. Authors wishing to do so must contact the Program Chair by September 1, clearly describing which papers the authors wish to present under the single registration, and why an exception to the conference policy is warranted. Unless permission is granted, an author planning to present two papers will be required to pay for two registrations.<\/p> <p>Authors of high-quality submissions of Full Research Papers will also have the opportunity to submit considerably extended versions of their MASM contributions to <em>IEEE Transactions on Semiconductor Manufacturing<\/em>.<\/p>\n<h2>Important Dates<\/h2> <h3>Full Research Papers:<\/h3> <p><strong>Immediately:<\/strong> Submission open<\/p> <p><strong>April 7, 2023:<\/strong> Submission due<\/p> <p><strong>April 28, 2023:<\/strong> Submission due for invited papers<\/p> <p><strong>June 2, 2023:<\/strong> Notification of acceptance<\/p> <p><strong>July 2, 2023:<\/strong> Camera-ready paper due<\/p> <h3>Extended Abstracts for Industrial Case Studies:<\/h3> <p><strong>May 1, 2023:<\/strong> Submission open<\/p> <p><strong>August 4, 2023<\/strong>: Submission due<\/p> <p><strong>September 1, 2023:<\/strong> Notification of acceptance<\/p> <p><strong>September 15, 2023:<\/strong> Camera-ready abstract due<\/p> <p>Please follow the\u00a0<a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/authorsubmission\/\" data-feathr-click-track=\"true\" data-feathr-link-aids=\"["622fa93bb0ebf976bd76e19a"]\">2023 WSC Author Kit<\/a>\u00a0to prepare your MASM 2023 Paper or Extended Abstract.<\/p>\n<h3>Conference Organizers<\/h3> <p>John W. Fowler, Arizona State University, USA<br \/>Lars M\u00f6nch, University of Hagen, Germany<br \/>Young Jae Jang, KAIST, South Korea<\/p> <h3>International Program Committee<\/h3> <p>Jakey Blue, National Taiwan University, Taiwan<br \/>Chen-Fu Chien, National Tsing-Hua University, Taiwan<br \/>St\u00e9phane Dauz\u00e8re-P\u00e9r\u00e8s, Ecole des Mines de Saint-Etienne, France<br \/>Hans Ehm, Infineon Technologies, Germany<br \/>Ken Fordyce, Arkieva, USA<br \/>Michael Hassoun, Ariel University, Israel<br \/>Cathal Heavey, University of Limerick, Ireland<br \/>Jesus Jimenez, Texas State University, USA<br \/>Myoungsoo (Andy) Ham, Liberty University, USA<br \/>Chiang Hsu, TSMC, Taiwan<br \/>Baris Kacar, SAS, USA<br \/>Adar Kalir, Intel, Israel<br \/>DJ Kim, Micron Technology, USA<br \/>Hyun-Jung Kim, KAIST, South Korea<br \/>Andreas Klemmt, Infineon Technologies, Germany<br \/>Tae-Eog Lee, KAIST, South Korea<br \/>Peter Lendermann, D-SIMLAB Technologies, Singapore<br \/>John Milne, Clarkson University, USA<br \/>James Morrison, Central Michigan University, USA<br \/>Tina O\u2019Donnell, Seagate Technology, Derry, United Kingdom<br \/>Detlef Pabst, Global Foundries, USA<br \/>Thomas Ponsignon, Infineon Technologies, Germany<br \/>Oliver Rose, Universit\u00e4t der Bundeswehr M\u00fcnchen, Germany<br \/>Ralf Sprenger, Infineon Technologies, Germany<br \/>Marcel Stehli, Global Foundries, Germany<br \/>Gian Antonio Susto, University of Padova, Italy<br \/>Reha Uzsoy, North Carolina State University, USA<br \/>Philippe Vialletelle, ST Microelectronics, France<br \/>Jei-Zheng Wu, Soochow University Taipei, Taiwan<br \/>Claude Yugma, Ecole de Mines de Saint-Etienne, France<\/p>\n<h3>MASM Keynote<\/h3> <p>Hans is Senior Principal Supply Chain of Infineon Technologies AG and is responsible for supply chain innovations. He holds degrees in Physics (Dipl. Ing (FH) HS Munich) from Germany and a Masters degree in Mechanical Engineering from Oregon State University\/ USA. He has almost 40 years of experience in the semiconductor industry, including managing wafer fabrication, assembly & test, and global supply chain operations.<\/p> <p>Hans was on the Supervisory Board of camLine Holding AG, an IT company providing software for supply and quality chains for over ten years until 2020. He was chairman of the <em>European Leadership Team<\/em> of the <em>Supply Chain Council<\/em> and is a <a href=\"https:\/\/nam11.safelinks.protection.outlook.com\/?url=https%3A%2F%2Fwww.logistik-heute.de%2FLogistik-News-Logistik-Nachrichten%2FMarkt-News%2F10647%2FInfineon-Cheflogistiker-Hans-Ehm-steht-globalem-Supply-Chain-Council-vor-Per&data=05%7C01%7Cjshortle%40gmu.edu%7C68d5d5bb983f4509f64f08db0aa6ba3e%7C9e857255df574c47a0c00546460380cb%7C0%7C0%7C638115483430297180%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C3000%7C%7C%7C&sdata=tGuQPI8XOu6rEDyLX1ZAZYWxuqzW5bX%2FIWFPV%2BQjNyk%3D&reserved=0\">past Board Member<\/a> of APICS SCC. He leads the working group (Arbeitskreis) SCM of the ZVEI. He is active in several EU projects like <a href=\"https:\/\/nam11.safelinks.protection.outlook.com\/?url=https%3A%2F%2Fsc3-project.automotive.oth-aw.de%2F&data=05%7C01%7Cjshortle%40gmu.edu%7C68d5d5bb983f4509f64f08db0aa6ba3e%7C9e857255df574c47a0c00546460380cb%7C0%7C0%7C638115483430297180%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C3000%7C%7C%7C&sdata=ipKQ7h1zIoC%2B5OVLYtxiPgAR0G9MG%2F%2F0EUVhgSrf2MU%3D&reserved=0\">SC\u00b3<\/a> - semantically connected semiconductor supply chains.<\/p> <p>Hans has taught Supply Chain Management and been involved in curriculum development at several universities. In 2015, he was awarded with the renowned <a href=\"https:\/\/nam11.safelinks.protection.outlook.com\/?url=https%3A%2F%2Fwww.facebook.com%2FInfineon%2Fposts%2Fcongratulations-hans-ehm!-he-got%2F812593768823406%2F&data=05%7C01%7Cjshortle%40gmu.edu%7C68d5d5bb983f4509f64f08db0aa6ba3e%7C9e857255df574c47a0c00546460380cb%7C0%7C0%7C638115483430297180%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C3000%7C%7C%7C&sdata=lp5TCxx9aojKc1IB0AVhyhX7z2AqUeo5XWUIRpSnvVQ%3D&reserved=0\">LEO-Award<\/a> (<em>Logistics Excellence Optimisation<\/em>) in the category \u201cManager\u201d from DVZ Media Group. <a href=\"https:\/\/nam11.safelinks.protection.outlook.com\/?url=https%3A%2F%2Fwww.supplychainmovement.com%2Fchris-tyas-of-nestle-named-as-no-1-supply-chain-executive-in-dach-region%2F&data=05%7C01%7Cjshortle%40gmu.edu%7C68d5d5bb983f4509f64f08db0aa6ba3e%7C9e857255df574c47a0c00546460380cb%7C0%7C0%7C638115483430297180%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C3000%7C%7C%7C&sdata=JkhPQdL6lwf6HWFgP1xls2lu%2B1ILvdUoMvDI14ThFKA%3D&reserved=0\">SCM Movement listed him as one of the 10 most influential SCM Managers in the DACH region 2018<\/a>.<\/p> <p>Hans is a co-organizer of Dagstuhl Seminar 23362 \"Decision-Making Techniques for Smart Semiconductor Manufacturing\" scheduled for September 3-8, 2023. He publishes his work see <a href=\"https:\/\/nam11.safelinks.protection.outlook.com\/?url=https%3A%2F%2Fscholar.google.com%2Fcitations%3Fuser%3Di7bdrB4AAAAJ%26hl%3Dde&data=05%7C01%7Cjshortle%40gmu.edu%7C68d5d5bb983f4509f64f08db0aa6ba3e%7C9e857255df574c47a0c00546460380cb%7C0%7C0%7C638115483430297180%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C3000%7C%7C%7C&sdata=CFUgXWCWJFATGBqJpk4xUhyv97anwRHfrQCyRULRb48%3D&reserved=0\">google scholar<\/a> or the <a href=\"https:\/\/nam11.safelinks.protection.outlook.com\/?url=https%3A%2F%2Fwww.researchgate.net%2Flab%2FSupply-Chain-Innovation-Hans-Ehm&data=05%7C01%7Cjshortle%40gmu.edu%7C68d5d5bb983f4509f64f08db0aa6ba3e%7C9e857255df574c47a0c00546460380cb%7C0%7C0%7C638115483430297180%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C3000%7C%7C%7C&sdata=HR94WcKdpNyWwmmeMnNUNj861HDHwYbUf5LJr2u1hYg%3D&reserved=0\">Ehm\u2019s lab on Research Gate<\/a>.<\/p>\n<img src=\"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/files\/2023\/02\/Hans-Ehm.jpg\" title=\"Hans Ehm\" alt=\"Hans Ehm Senior Principal Supply Chain Infineon Technologies AG\" srcset=\"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/files\/2023\/02\/Hans-Ehm.jpg 408w, https:\/\/meetings.informs.org\/wordpress\/wsc2023\/files\/2023\/02\/Hans-Ehm-214x300.jpg 214w\" sizes=\"(max-width: 408px) 100vw, 408px\" \/> <strong>Hans Ehm<\/strong><br\/> <strong>Senior Principal Supply Chain<\/strong><br\/> <strong>Infineon Technologies AG<\/strong>","_links":{"self":[{"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/wp-json\/wp\/v2\/pages\/4423","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/wp-json\/wp\/v2\/users\/1001065"}],"replies":[{"embeddable":true,"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/wp-json\/wp\/v2\/comments?post=4423"}],"version-history":[{"count":97,"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/wp-json\/wp\/v2\/pages\/4423\/revisions"}],"predecessor-version":[{"id":8195,"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/wp-json\/wp\/v2\/pages\/4423\/revisions\/8195"}],"wp:attachment":[{"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/wp-json\/wp\/v2\/media?parent=4423"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}