{"id":7447,"date":"2022-07-06T14:18:41","date_gmt":"2022-07-06T14:18:41","guid":{"rendered":"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/?page_id=7447"},"modified":"2023-08-07T15:00:12","modified_gmt":"2023-08-07T15:00:12","slug":"simulation-challenge","status":"publish","type":"page","link":"https:\/\/meetings.informs.org\/wordpress\/wsc2023\/simulation-challenge\/","title":{"rendered":"Simulation Challenge 2023"},"content":{"rendered":"\n
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The \u201cSimulation Challenge\u201d (previously named the \u201cCase Study Competition\u201d) in Winter Simulation Conference (WSC) was initially launched in 2022, with the aim to delve into the significance of simulation and pave the way for increased collaboration between academia and industry. Through this initiative, we target to foster an environment of interdisciplinary cooperation that encourages innovation and fosters the creation of cutting-edge solutions to real-world problems.

With the theme “Simulation for Resilient Systems”, the Simulation Challenge in WSC2023 will continue to encourage participants to explore the latest advances in simulation technology and their application to next-generation industrial systems. Participants will be required to present case studies that demonstrate the use of simulation to design, optimize, and evaluate systems that are resilient, sustainable, and adaptable to changing circumstances. The competition will provide a unique opportunity to engage with leading experts in the field, gain recognition for their work, and potentially win prizes.

As we all know, the global semiconductor chip supply is facing severe challenges this year. For a society that is highly dependent on electronic equipment, the technological innovation of the chip industry and the reconstruction of the manufacturing system may deeply affect the digital lifestyle we are familiar with. As researchers and developers in the field of simulation, we eagerly hope to use simulation modeling and analysis tools to solve bottleneck problems in chip manufacturing and improve the efficiency and resilience of the systems. Therefore, we sincerely invited Micron Semiconductor (Asia) as a co-organizer and sponsor of this competition, and one issue of their concerns will be chosen to be the topic of the Simulation Challenge 2023. We strongly encourage all who are interested in simulation to join us and try your hand at the Simulation Challenge!<\/p>\n

This competition will be co-organized by the ISEM Department of National University of Singapore,\u00a0 Engineering at the University of Exeter, ISE Department at KAIST, and Guanghua School of Management at Peking University. Stay tuned and keep a lookout on this page for more updates!<\/p>\n

For any inquiries, please feel free to drop our Simulation Challenge Chair, Dr. Li Haobin<\/a>\u00a0 and Co-Chair, Dr. Martino Luis<\/a>.<\/p> <\/div>\n<\/div>\n <\/div>\n <\/div>\n <\/div>\n

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Problem Description<\/strong><\/h2>\n

Using the typical problem in the fabrication process as the case study for this competition, the organizers will build a basic simulation system model with discrete-event modeling methods and implement it in an open-source DES framework (O2DES.NET or o2despy). The organizers will also provide clear documentation to describe the model structure according to the rigorously defined modeling formalism.<\/p>\n

The organizers will specify the data and source code according to the following three aspects of information:<\/p>\n