{"id":4423,"date":"2017-01-18T15:45:01","date_gmt":"2017-01-18T15:45:01","guid":{"rendered":"https:\/\/meetings.informs.org\/wordpress\/meetings2-2\/?page_id=4423"},"modified":"2025-08-01T16:39:45","modified_gmt":"2025-08-01T16:39:45","slug":"masm","status":"publish","type":"page","link":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/masm\/","title":{"rendered":"Modeling and Analysis of Semiconductor Manufacturing"},"content":{"rendered":"<!--themify_builder_content-->\n<div id=\"themify_builder_content-4423\" data-postid=\"4423\" class=\"themify_builder_content themify_builder_content-4423 themify_builder tf_clear\">\n                    <div  data-lazy=\"1\" class=\"module_row themify_builder_row tb_pfz4851 tb_first tf_w\">\n                        <div class=\"row_inner col_align_top tb_col_count_3 tf_box tf_rel\">\n                        <div  data-lazy=\"1\" class=\"module_column tb-column col4-2 tb_ene6852 first\">\n                    <!-- module text -->\n<div  class=\"module module-text tb_1bln309   \" data-lazy=\"1\">\n        <div  class=\"tb_text_wrap\">\n        <h2><strong>21st International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) <\/strong><\/h2>\n<p><strong>Seattle, WA<br \/><\/strong><strong>December 7-10, 2025<\/strong><\/p>\n<p><em>Part of the Winter Simulation Conference (WSC) 2025<\/em><\/p>\n<p>The <strong>International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM)<\/strong> is an annual forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world involved in modelling and analysis of complex high-tech manufacturing systems.<\/p>\n<p>The MASM Conference is fully contained within the Winter Simulation Conference (WSC), the world-leading conference for Discrete Event Simulation, but covers a much wider range of techniques and approaches that also include optimization, scheduling, queueing theory, process control, data analysis and machine learning. It features a comprehensive program ranging from state-of-the-art research to recent case studies demonstrating the relevance of these techniques for Smart Manufacturing.<\/p>\n<p>The MASM 2025 conference will take place at the Sheraton Grand Seattle in Seattle, Washington USA. The hotel is located in the heart of downtown Seattle within walking distance to Pike Market and Seattle Waterfront. The WSC keynote presentation will be given by the Chief of the Simulation and Graphics Branch at NASA.<\/p>\n<p>For 2025 we are asking not just for Full Research Papers but also for relevant Industrial Case Studies illustrating the benefits that have been achieved with novel methodologies and solutions. These Industrial Case Study presentations will be fully integrated into the respective MASM application track but will only require a 2-page \u201cExtended Abstract\u201d and have shorter submission lead times to facilitate participation from the industry. Unlike Full Research Papers, Extended Abstracts will appear only in the INFORMS Simulation Society archives but not in the ACM and IEEE digital proceedings.<\/p>\n<p>We are looking for high-quality academic and applied research and relevant industrial case studies at all levels of Semiconductor Manufacturing.<\/p>\n<p>At the <strong>equipment and process level<\/strong>, we cover various aspects of Equipment Maintenance and Productivity, Quality and Advanced Process Control (Statistical Process Control, Fault Detection and Classification, Run To Run, Virtual Metrology, etc.), but also how to handle and exploit the huge amount of data generated in wafer fabs (Big Data). As such we also invite submissions from leading Semiconductor Equipment Manufacturers.<\/p>\n<p>At the <strong>shop-floor level<\/strong>, optimized WIP management, dispatching, scheduling and sampling of lots or qualification management of products on machines remain critical, in particular when handling complex constraints.<\/p>\n<p>At the <strong>factory level<\/strong>, it is important to develop efficient transportation and storage policies, production and capacity planning approaches, in order to reduce cycle times and time-to-market.<\/p>\n<p>At the <strong>strategic level<\/strong>, demand planning, factory economics and cost modelling, new product introduction, and supply chain efficiency are important topics to support the business.<\/p>\n<p>We invite participants to present on all topics related to modeling and analysis that will help address these challenges. We also welcome contributions that integrate decisions or information at different decision levels which is becoming a must. These various goals will be attained through new advanced control and statistical methods, novel computing techniques, methods from artificial intelligence, and operations research methods<\/p>\n<p>While the MASM Conference is mostly focused on the current semiconductor industry state-of-the-art, neither presenters nor attendees need to be in the IC industry to participate. We are interested in methodologies, research and\/or applications from other related industries such as TFT-LCD, flexible displays, bio-chip, solid state lighting (LED), and photovoltaic (PV) that might also share or want to share common and new practices. Interested individuals within academia, government agencies, equipment suppliers, manufacturers, students, contractors, and other interested parties are encouraged to participate.<\/p>\n<p>All attendees of the MASM Conference will register for Winter Simulation Conference at the same cost. In turn, all participants of WSC can attend the respective MASM sessions.<\/p>\n<p>Each accepted paper and case study presentation must have a separate, paid registration. Only under highly unusual circumstances, and at the discretion of the conference leadership, will an author be allowed to present more than one paper on a single registration. Authors wishing to do so must contact the Program Chair by September 1, clearly describing which papers the authors wish to present under the single registration, and why an exception to the conference policy is warranted. Unless permission is granted, an author planning to present two papers will be required to pay for two registrations.<\/p>\n<p>Authors of high-quality submissions of Full Research Papers will also have the opportunity to submit considerably extended versions of their MASM contributions to <em>IEEE Transactions on Semiconductor Manufacturing<\/em>.<\/p>    <\/div>\n<\/div>\n<!-- \/module text -->        <\/div>\n                    <div  data-lazy=\"1\" class=\"module_column tb-column col4-1 tb_g8l7799\">\n                    <!-- module text -->\n<div  class=\"module module-text tb_msnx200   \" data-lazy=\"1\">\n        <div  class=\"tb_text_wrap\">\n        <h3>Conference Organizers<\/h3>\n<ul>\n<li>John W. Fowler, Arizona State University, USA<\/li>\n<li>Chia-Yen Lee, National Taiwan University, Taiwan<\/li>\n<li>Lars M\u00f6nch, University of Hagen, Germany<\/li>\n<\/ul>\n<h3>International Program Committee<\/h3>\n<ul>\n<li>Jakey Blue, National Taiwan University, Taiwan<\/li>\n<li>Chen-Fu Chien, National Tsing-Hua University, Taiwan<\/li>\n<li>St\u00e9phane Dauz\u00e8re-P\u00e9r\u00e8s, Ecole des Mines de Saint-Etienne, France<\/li>\n<li>Hans Ehm, Infineon Technologies, Germany<\/li>\n<li>Ken Fordyce, Arkieva, USA<\/li>\n<li>Feng Ju, Arizona State University, USA<\/li>\n<li>Michael Hassoun, Ariel University, Israel<\/li>\n<li>Cathal Heavey, University of Limerick, Ireland<\/li>\n<li>Jesus Jimenez, Texas State University, USA<\/li>\n<li>Myoungsoo (Andy) Ham, Liberty University, USA<\/li>\n<li>Chiang Hsu, TSMC, Taiwan<\/li>\n<li>Young Jae Jang, KAIST, South Korea<\/li>\n<li>Baris Kacar, SAS, USA<\/li>\n<li>Adar Kalir, Intel, Israel<\/li>\n<li>DJ Kim, Micron Technology, USA<\/li>\n<li>Hyun-Jung Kim, KAIST, South Korea<\/li>\n<li>Andreas Klemmt, Infineon Technologies, Germany<\/li>\n<li>Douniel Lamghari-Idrissi, ASML, Netherlands<\/li>\n<li>Tae-Eog Lee, KAIST, South Korea<\/li>\n<li>Peter Lendermann, D-SIMLAB Technologies, Singapore<\/li>\n<li>Andrea Matta, POLITECNICO DI MILANO, Italy<\/li>\n<li>John Milne, Clarkson University, USA<\/li>\n<li>James Morrison, Central Michigan University, USA<\/li>\n<li>Tina O\u2019Donnell, Seagate Technology, Derry, United Kingdom<\/li>\n<li>Detlef Pabst, Global Foundries, USA<\/li>\n<li>Thomas Ponsignon, Infineon Technologies, Germany<\/li>\n<li>Alexandru Prisacaru, Bosch, Germany<\/li>\n<li>Oliver Rose, Universit\u00e4t der Bundeswehr M\u00fcnchen, Germany<\/li>\n<li>Kai Schelthoff, NXP, Netherlands<\/li>\n<li>Ralf Sprenger, Infineon Technologies, Germany<\/li>\n<li>Marcel Stehli, Global Foundries, Germany<\/li>\n<li>Gian Antonio Susto, University of Padova, Italy<\/li>\n<li>Reha Uzsoy, North Carolina State University, USA<\/li>\n<li>Cheng-Hung Wu, National Taiwan University, Taiwan<\/li>\n<li>Jei-Zheng Wu, Soochow University Taipei, Taiwan<\/li>\n<li>Claude Yugma, Ecole de Mines de Saint-Etienne, France<\/li>\n<\/ul>    <\/div>\n<\/div>\n<!-- \/module text -->        <\/div>\n                    <div  data-lazy=\"1\" class=\"module_column tb-column col4-1 tb_uu2a146 last\">\n                    <!-- module text -->\n<div  class=\"module module-text tb_izyw532  repeat \" data-lazy=\"1\">\n        <div  class=\"tb_text_wrap\">\n        <h2>Important Dates<\/h2>\n<h3>Full Research Papers:<\/h3>\n<p><span style=\"color: #003087;\"><strong>March 1, 2025:<\/strong> <\/span>Submission open<\/p>\n<p><span style=\"color: #003087;\"><strong>April 11, 2025: <\/strong><\/span>Submissions due for Contributed Papers using the 2025 Authors Kit available <a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/authorsubmission\/\">here<\/a><\/p>\n<p><span style=\"color: #003087;\"><strong>May 2, 2025 : <\/strong><\/span>Submissions due for Invited Papers using the 2025 Authors Kit available <a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/authorsubmission\/\">here<\/a><\/p>\n<p><span style=\"color: #003087;\"><strong>June 2, 2025:<\/strong><\/span> Notification of acceptance<\/p>\n<p><span style=\"color: #003087;\"><strong>June 27, 2025:<\/strong> <\/span>Authors electronically submit fully corrected (camera-ready) papers for review by the Proceedings Editors<\/p>\n<h3>Extended Abstracts for Industrial Case Studies:<\/h3>\n<p><span style=\"color: #003087;\"><strong>May 5, 2025:<\/strong><\/span> Submission open for extended abstracts<\/p>\n<p><span style=\"color: #003087;\"><strong>August 8, 2025<\/strong>: <\/span>Electronically submit 2-page extended abstracts using the 2025 Authors Kit available <a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/authorsubmission\/\">here<\/a><\/p>\n<p><span style=\"color: #003087;\"><strong>September 1, 2025:<\/strong><\/span> Notification of acceptance to authors (including details about submitting slides, and formats of the posters<\/p>\n<p><span style=\"color: #003087;\"><strong>September 12, 2025:<\/strong><\/span> Final camera-ready extended abstracts due<\/p>\n<p>Please follow the <a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/authorsubmission\/\">2025 WSC Author Kit <\/a>to prepare your MASM 2024 Paper or Extended Abstract.<\/p>    <\/div>\n<\/div>\n<!-- \/module text -->        <\/div>\n                        <\/div>\n        <\/div>\n                        <div  data-css_id=\"g9w1431\" data-lazy=\"1\" class=\"module_row themify_builder_row fullwidth_row_container tb_g9w1431 tf_w\">\n                        <div class=\"row_inner col_align_top tb_col_count_2 tf_box tf_rel\">\n                        <div  data-lazy=\"1\" class=\"module_column tb-column col3-2 tb_jmt4433 first\">\n                    <!-- module text -->\n<div  class=\"module module-text tb_cmhb366   \" data-lazy=\"1\">\n        <div  class=\"tb_text_wrap\">\n        <h3>MASM Keynote<\/h3>\n<p><strong>Devadas Pillai<\/strong> is a retired Intel Senior Fellow &amp; former director who led the development and proliferation of simulation modeling methods &amp; optimization tools across Intel&#8217;s technology development and high-volume manufacturing fabs worldwide for over 2 decades.<\/p>\n<p>Pillai was Intel\u2019s first Fellow whose technical expertise is factory automation and robotics manufacturing. He has been honored many times by his industry peers as one of the most influential leaders who drove the vision and worldwide industry direction for 300 mm fab standardization resulting in pervasive fab automation and modeling tools for improving IC manufacturing.<\/p>\n<p>Pillai has written more than 90 peer-reviewed technical papers and keynote presentations in IEEE, ISSM, IEDM, SME, JES, IIE, SEMI and others in the fields of factory automation and operational modeling.<\/p>    <\/div>\n<\/div>\n<!-- \/module text -->        <\/div>\n                    <div  data-lazy=\"1\" class=\"module_column tb-column col3-1 tb_70cf538 last\">\n                    <!-- module image -->\n<div  class=\"module module-image tb_jks0204 image-top   tf_mw\" data-lazy=\"1\">\n        <div class=\"image-wrap tf_rel tf_mw\">\n            <img loading=\"lazy\" decoding=\"async\" width=\"553\" height=\"750\" src=\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/files\/2025\/04\/Devadas-Pillai.jpg\" class=\"wp-post-image wp-image-10800\" title=\"Devadas Pillai\" alt=\"Devadas \u201cDave\u201d Pillai\nRetired Senior Fellow &amp; Former Director\nIntel\" srcset=\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/files\/2025\/04\/Devadas-Pillai.jpg 553w, https:\/\/meetings.informs.org\/wordpress\/wsc2025\/files\/2025\/04\/Devadas-Pillai-221x300.jpg 221w\" sizes=\"auto, (max-width: 553px) 100vw, 553px\" \/>    \n        <\/div>\n    <!-- \/image-wrap -->\n    \n        <div class=\"image-content\">\n                        <div class=\"image-caption tb_text_wrap\">\n            <strong>Devadas \u201cDave\u201d Pillai<\/strong><br\/>\n<strong>Retired Senior Fellow &#038; Former Director<\/strong><br\/>\n<strong>Intel<\/strong><br\/>        <\/div>\n        <!-- \/image-caption -->\n            <\/div>\n    <!-- \/image-content -->\n        <\/div>\n<!-- \/module image -->        <\/div>\n                        <\/div>\n        <\/div>\n        <\/div>\n<!--\/themify_builder_content-->","protected":false},"excerpt":{"rendered":"<p>21st International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) Seattle, WADecember 7-10, 2025 Part of the Winter Simulation Conference (WSC) 2025 The International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) is an annual forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world involved [&hellip;]<\/p>\n","protected":false},"author":1001065,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"class_list":["post-4423","page","type-page","status-publish","hentry","has-post-title","has-post-date","has-post-category","has-post-tag","has-post-comment","has-post-author",""],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v26.0 (Yoast SEO v26.0) - 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Winter Simulation Conference 2025\",\"isPartOf\":{\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/#website\"},\"datePublished\":\"2017-01-18T15:45:01+00:00\",\"dateModified\":\"2025-08-01T16:39:45+00:00\",\"description\":\"The 2025 MASM is a forum for exchanging of ideas and industrial innovations in modeling and analysis of complex high-tech manufacturing systems.\",\"breadcrumb\":{\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/masm\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/masm\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/masm\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Modeling and Analysis of Semiconductor Manufacturing\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/#website\",\"url\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/\",\"name\":\"Winter Simulation Conference 2025\",\"description\":\"Winter Simulation Conference 2025\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"}]}<\/script>\n<!-- \/ Yoast SEO Premium plugin. -->","yoast_head_json":{"title":"Modeling and Analysis of Semiconductor Manufacturing - Winter Simulation Conference 2025","description":"The 2025 MASM is a forum for exchanging of ideas and industrial innovations in modeling and analysis of complex high-tech manufacturing systems.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/masm\/","og_locale":"en_US","og_type":"article","og_title":"Modeling and Analysis of Semiconductor Manufacturing","og_description":"The 2025 MASM is a forum for exchanging of ideas and industrial innovations in modeling and analysis of complex high-tech manufacturing systems.","og_url":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/masm\/","og_site_name":"Winter Simulation Conference 2025","article_modified_time":"2025-08-01T16:39:45+00:00","og_image":[{"width":300,"height":315,"url":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/files\/2024\/01\/WSC_2024_Logo-1.png","type":"image\/png"}],"twitter_card":"summary_large_image","schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/masm\/","url":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/masm\/","name":"Modeling and Analysis of Semiconductor Manufacturing - Winter Simulation Conference 2025","isPartOf":{"@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/#website"},"datePublished":"2017-01-18T15:45:01+00:00","dateModified":"2025-08-01T16:39:45+00:00","description":"The 2025 MASM is a forum for exchanging of ideas and industrial innovations in modeling and analysis of complex high-tech manufacturing systems.","breadcrumb":{"@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/masm\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/meetings.informs.org\/wordpress\/wsc2025\/masm\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/masm\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/"},{"@type":"ListItem","position":2,"name":"Modeling and Analysis of Semiconductor Manufacturing"}]},{"@type":"WebSite","@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/#website","url":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/","name":"Winter Simulation Conference 2025","description":"Winter Simulation Conference 2025","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"}]}},"builder_content":"<h2><strong>21st International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) <\/strong><\/h2> <p><strong>Seattle, WA<br \/><\/strong><strong>December 7-10, 2025<\/strong><\/p> <p><em>Part of the Winter Simulation Conference (WSC) 2025<\/em><\/p> <p>The <strong>International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM)<\/strong> is an annual forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world involved in modelling and analysis of complex high-tech manufacturing systems.<\/p> <p>The MASM Conference is fully contained within the Winter Simulation Conference (WSC), the world-leading conference for Discrete Event Simulation, but covers a much wider range of techniques and approaches that also include optimization, scheduling, queueing theory, process control, data analysis and machine learning. It features a comprehensive program ranging from state-of-the-art research to recent case studies demonstrating the relevance of these techniques for Smart Manufacturing.<\/p> <p>The MASM 2025 conference will take place at the Sheraton Grand Seattle in Seattle, Washington USA. The hotel is located in the heart of downtown Seattle within walking distance to Pike Market and Seattle Waterfront. The WSC keynote presentation will be given by the Chief of the Simulation and Graphics Branch at NASA.<\/p> <p>For 2025 we are asking not just for Full Research Papers but also for relevant Industrial Case Studies illustrating the benefits that have been achieved with novel methodologies and solutions. These Industrial Case Study presentations will be fully integrated into the respective MASM application track but will only require a 2-page \u201cExtended Abstract\u201d and have shorter submission lead times to facilitate participation from the industry. Unlike Full Research Papers, Extended Abstracts will appear only in the INFORMS Simulation Society archives but not in the ACM and IEEE digital proceedings.<\/p> <p>We are looking for high-quality academic and applied research and relevant industrial case studies at all levels of Semiconductor Manufacturing.<\/p> <p>At the <strong>equipment and process level<\/strong>, we cover various aspects of Equipment Maintenance and Productivity, Quality and Advanced Process Control (Statistical Process Control, Fault Detection and Classification, Run To Run, Virtual Metrology, etc.), but also how to handle and exploit the huge amount of data generated in wafer fabs (Big Data). As such we also invite submissions from leading Semiconductor Equipment Manufacturers.<\/p> <p>At the <strong>shop-floor level<\/strong>, optimized WIP management, dispatching, scheduling and sampling of lots or qualification management of products on machines remain critical, in particular when handling complex constraints.<\/p> <p>At the <strong>factory level<\/strong>, it is important to develop efficient transportation and storage policies, production and capacity planning approaches, in order to reduce cycle times and time-to-market.<\/p> <p>At the <strong>strategic level<\/strong>, demand planning, factory economics and cost modelling, new product introduction, and supply chain efficiency are important topics to support the business.<\/p> <p>We invite participants to present on all topics related to modeling and analysis that will help address these challenges. We also welcome contributions that integrate decisions or information at different decision levels which is becoming a must. These various goals will be attained through new advanced control and statistical methods, novel computing techniques, methods from artificial intelligence, and operations research methods<\/p> <p>While the MASM Conference is mostly focused on the current semiconductor industry state-of-the-art, neither presenters nor attendees need to be in the IC industry to participate. We are interested in methodologies, research and\/or applications from other related industries such as TFT-LCD, flexible displays, bio-chip, solid state lighting (LED), and photovoltaic (PV) that might also share or want to share common and new practices. Interested individuals within academia, government agencies, equipment suppliers, manufacturers, students, contractors, and other interested parties are encouraged to participate.<\/p> <p>All attendees of the MASM Conference will register for Winter Simulation Conference at the same cost. In turn, all participants of WSC can attend the respective MASM sessions.<\/p> <p>Each accepted paper and case study presentation must have a separate, paid registration. Only under highly unusual circumstances, and at the discretion of the conference leadership, will an author be allowed to present more than one paper on a single registration. Authors wishing to do so must contact the Program Chair by September 1, clearly describing which papers the authors wish to present under the single registration, and why an exception to the conference policy is warranted. Unless permission is granted, an author planning to present two papers will be required to pay for two registrations.<\/p> <p>Authors of high-quality submissions of Full Research Papers will also have the opportunity to submit considerably extended versions of their MASM contributions to <em>IEEE Transactions on Semiconductor Manufacturing<\/em>.<\/p>\n<h3>Conference Organizers<\/h3> <ul> <li>John W. Fowler, Arizona State University, USA<\/li> <li>Chia-Yen Lee, National Taiwan University, Taiwan<\/li> <li>Lars M\u00f6nch, University of Hagen, Germany<\/li> <\/ul> <h3>International Program Committee<\/h3> <ul> <li>Jakey Blue, National Taiwan University, Taiwan<\/li> <li>Chen-Fu Chien, National Tsing-Hua University, Taiwan<\/li> <li>St\u00e9phane Dauz\u00e8re-P\u00e9r\u00e8s, Ecole des Mines de Saint-Etienne, France<\/li> <li>Hans Ehm, Infineon Technologies, Germany<\/li> <li>Ken Fordyce, Arkieva, USA<\/li> <li>Feng Ju, Arizona State University, USA<\/li> <li>Michael Hassoun, Ariel University, Israel<\/li> <li>Cathal Heavey, University of Limerick, Ireland<\/li> <li>Jesus Jimenez, Texas State University, USA<\/li> <li>Myoungsoo (Andy) Ham, Liberty University, USA<\/li> <li>Chiang Hsu, TSMC, Taiwan<\/li> <li>Young Jae Jang, KAIST, South Korea<\/li> <li>Baris Kacar, SAS, USA<\/li> <li>Adar Kalir, Intel, Israel<\/li> <li>DJ Kim, Micron Technology, USA<\/li> <li>Hyun-Jung Kim, KAIST, South Korea<\/li> <li>Andreas Klemmt, Infineon Technologies, Germany<\/li> <li>Douniel Lamghari-Idrissi, ASML, Netherlands<\/li> <li>Tae-Eog Lee, KAIST, South Korea<\/li> <li>Peter Lendermann, D-SIMLAB Technologies, Singapore<\/li> <li>Andrea Matta, POLITECNICO DI MILANO, Italy<\/li> <li>John Milne, Clarkson University, USA<\/li> <li>James Morrison, Central Michigan University, USA<\/li> <li>Tina O\u2019Donnell, Seagate Technology, Derry, United Kingdom<\/li> <li>Detlef Pabst, Global Foundries, USA<\/li> <li>Thomas Ponsignon, Infineon Technologies, Germany<\/li> <li>Alexandru Prisacaru, Bosch, Germany<\/li> <li>Oliver Rose, Universit\u00e4t der Bundeswehr M\u00fcnchen, Germany<\/li> <li>Kai Schelthoff, NXP, Netherlands<\/li> <li>Ralf Sprenger, Infineon Technologies, Germany<\/li> <li>Marcel Stehli, Global Foundries, Germany<\/li> <li>Gian Antonio Susto, University of Padova, Italy<\/li> <li>Reha Uzsoy, North Carolina State University, USA<\/li> <li>Cheng-Hung Wu, National Taiwan University, Taiwan<\/li> <li>Jei-Zheng Wu, Soochow University Taipei, Taiwan<\/li> <li>Claude Yugma, Ecole de Mines de Saint-Etienne, France<\/li> <\/ul>\n<h2>Important Dates<\/h2> <h3>Full Research Papers:<\/h3> <p><strong>March 1, 2025:<\/strong> Submission open<\/p> <p><strong>April 11, 2025: <\/strong>Submissions due for Contributed Papers using the 2025 Authors Kit available <a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/authorsubmission\/\">here<\/a><\/p> <p><strong>May 2, 2025 : <\/strong>Submissions due for Invited Papers using the 2025 Authors Kit available <a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/authorsubmission\/\">here<\/a><\/p> <p><strong>June 2, 2025:<\/strong> Notification of acceptance<\/p> <p><strong>June 27, 2025:<\/strong> Authors electronically submit fully corrected (camera-ready) papers for review by the Proceedings Editors<\/p> <h3>Extended Abstracts for Industrial Case Studies:<\/h3> <p><strong>May 5, 2025:<\/strong> Submission open for extended abstracts<\/p> <p><strong>August 8, 2025<\/strong>: Electronically submit 2-page extended abstracts using the 2025 Authors Kit available <a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/authorsubmission\/\">here<\/a><\/p> <p><strong>September 1, 2025:<\/strong> Notification of acceptance to authors (including details about submitting slides, and formats of the posters<\/p> <p><strong>September 12, 2025:<\/strong> Final camera-ready extended abstracts due<\/p> <p>Please follow the <a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/authorsubmission\/\">2025 WSC Author Kit <\/a>to prepare your MASM 2024 Paper or Extended Abstract.<\/p>\n<h3>MASM Keynote<\/h3> <p><strong>Devadas Pillai<\/strong> is a retired Intel Senior Fellow &amp; former director who led the development and proliferation of simulation modeling methods &amp; optimization tools across Intel's technology development and high-volume manufacturing fabs worldwide for over 2 decades.<\/p> <p>Pillai was Intel\u2019s first Fellow whose technical expertise is factory automation and robotics manufacturing. He has been honored many times by his industry peers as one of the most influential leaders who drove the vision and worldwide industry direction for 300 mm fab standardization resulting in pervasive fab automation and modeling tools for improving IC manufacturing.<\/p> <p>Pillai has written more than 90 peer-reviewed technical papers and keynote presentations in IEEE, ISSM, IEDM, SME, JES, IIE, SEMI and others in the fields of factory automation and operational modeling.<\/p>\n<img src=\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/files\/2025\/04\/Devadas-Pillai.jpg\" title=\"Devadas Pillai\" alt=\"Devadas \u201cDave\u201d Pillai Retired Senior Fellow &amp; Former Director Intel\" srcset=\"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/files\/2025\/04\/Devadas-Pillai.jpg 553w, https:\/\/meetings.informs.org\/wordpress\/wsc2025\/files\/2025\/04\/Devadas-Pillai-221x300.jpg 221w\" sizes=\"(max-width: 553px) 100vw, 553px\" \/> <strong>Devadas \u201cDave\u201d Pillai<\/strong><br\/> <strong>Retired Senior Fellow & Former Director<\/strong><br\/> <strong>Intel<\/strong><br\/>","_links":{"self":[{"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/wp-json\/wp\/v2\/pages\/4423","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/wp-json\/wp\/v2\/users\/1001065"}],"replies":[{"embeddable":true,"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/wp-json\/wp\/v2\/comments?post=4423"}],"version-history":[{"count":153,"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/wp-json\/wp\/v2\/pages\/4423\/revisions"}],"predecessor-version":[{"id":11223,"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/wp-json\/wp\/v2\/pages\/4423\/revisions\/11223"}],"wp:attachment":[{"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2025\/wp-json\/wp\/v2\/media?parent=4423"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}