{"id":4423,"date":"2017-01-18T15:45:01","date_gmt":"2017-01-18T15:45:01","guid":{"rendered":"https:\/\/meetings.informs.org\/wordpress\/meetings2-2\/?page_id=4423"},"modified":"2026-02-23T22:45:07","modified_gmt":"2026-02-23T22:45:07","slug":"masm","status":"publish","type":"page","link":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/","title":{"rendered":"Modeling and Analysis of Semiconductor Manufacturing"},"content":{"rendered":"<!--themify_builder_content-->\n<div id=\"themify_builder_content-4423\" data-postid=\"4423\" class=\"themify_builder_content themify_builder_content-4423 themify_builder tf_clear\">\n                    <div  data-lazy=\"1\" class=\"module_row themify_builder_row tb_pfz4851 tb_first tf_w\">\n                        <div class=\"row_inner col_align_top tb_col_count_3 tf_box tf_rel\">\n                        <div  data-lazy=\"1\" class=\"module_column tb-column col4-2 tb_ene6852 first\">\n                    <!-- module text -->\n<div  class=\"module module-text tb_1bln309   \" data-lazy=\"1\">\n        <div  class=\"tb_text_wrap\">\n        <h2><strong>22nd International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) <\/strong><\/h2>\n<p><strong>Glasgow, Scotland<br \/><\/strong><strong>December 6-9, 2026<br \/><\/strong><br \/><em>Part of<\/em><\/p>\n<p><a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo.png\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone  wp-image-11791\" src=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo-300x283.png\" alt=\"\" width=\"190\" height=\"179\" srcset=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo-300x283.png 300w, https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo.png 353w\" sizes=\"auto, (max-width: 190px) 100vw, 190px\" \/><\/a><\/p>\n<p><em><strong>Simulation for Climate Resilience<\/strong><\/em><\/p>\n<p>The International Conference on Modelling and Analysis of Semiconductor Manufacturing (MASM) is an annual forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world involved in modelling and analysis of complex high-tech manufacturing systems.<\/p>\n<p>The MASM Conference is fully contained within the Winter Simulation Conference (WSC), the world-leading conference for Discrete Event Simulation, but covers a much wider range of techniques and approaches that also include optimization, scheduling, queueing theory, process control, data analysis, artificial intelligence, and machine learning. It features a comprehensive program ranging from state-of-the-art research to recent case studies demonstrating the relevance of these techniques for Smart Manufacturing.<\/p>\n<p>For 2026 we are asking not just for Full Research Papers but also for relevant Industrial Case Studies illustrating the benefits that have been achieved with novel methodologies and solutions. These Industrial Case Study presentations will be fully integrated into the respective MASM application track but will only require a 3-page \u201cExtended Abstract\u201d and have shorter submission lead times to facilitate participation from the industry. Unlike Full Research Papers, Extended Abstracts will appear only in the INFORMS Simulation Society archives but not in the ACM and IEEE digital proceedings.<\/p>\n<p>We are looking for high-quality academic and applied research and relevant industrial case studies at all levels of Semiconductor Manufacturing.<\/p>\n<p>At the <strong>equipment and process level<\/strong>, we cover various aspects of Equipment Maintenance and Productivity, Quality and Advanced Process Control (Statistical Process Control, Fault Detection and Classification, Run To Run, Virtual Metrology, etc.), but also how to handle and exploit the huge amount of data generated in wafer fabs (Big Data). As such we also invite submissions from leading Semiconductor Equipment Manufacturers.<\/p>\n<p>At the <strong>shop-floor level<\/strong>, optimized WIP management, dispatching, scheduling and sampling of lots or qualification management of products on machines remain critical, in particular when handling complex constraints.<\/p>\n<p>At the <strong>factory level<\/strong>, it is important to develop efficient transportation and storage policies, production and capacity planning approaches, in order to reduce cycle times and time-to-market.<\/p>\n<p>At the <strong>strategic level<\/strong>, demand planning, factory economics and cost modelling, new product introduction, and supply chain efficiency are important topics to support the business.<\/p>\n<p>We invite participants to present on all topics related to modelling and analysis that will help address these challenges, including the human in-the-loop challenge. We also welcome contributions that integrate decisions or information at different decision levels which is becoming a must. These various goals will be attained through new advanced control and statistical methods, novel computing techniques, methods from artificial intelligence, and operations research methods.<\/p>\n<p>While the MASM Conference is mostly focused on the current semiconductor industry state-of-the-art, neither presenters nor attendees need to be in the IC industry to participate. We are interested in methodologies, research and\/or applications from other related industries such as TFT-LCD, flexible displays, bio-chip, solid state lighting (LED), and photovoltaic (PV) that might also share or want to share common and new practices. Interested individuals within academia, government agencies, equipment suppliers, manufacturers, students, contractors, and other interested parties are encouraged to participate.<\/p>\n<p>All attendees of the MASM Conference will register for Winter Simulation Conference at the same cost. In turn, all participants of WSC can attend the respective MASM sessions.<\/p>\n<p>Each accepted paper and case study presentation must have a separate, paid registration. Only under highly unusual circumstances, and at the discretion of the conference leadership, will an author be allowed to present more than one paper on a single registration. Authors wishing to do so must contact the Program Chair by September 1, clearly describing which papers the authors wish to present under the single registration, and why an exception to the conference policy is warranted. Unless permission is granted, an author planning to present two papers will be required to pay for two registrations.<\/p>\n<p>Authors of high-quality submissions of Full Research Papers will also have the opportunity to submit considerably extended versions of their MASM contributions to IEEE Transactions on Semiconductor Manufacturing.<\/p>    <\/div>\n<\/div>\n<!-- \/module text -->        <\/div>\n                    <div  data-lazy=\"1\" class=\"module_column tb-column col4-1 tb_g8l7799\">\n                    <!-- module text -->\n<div  class=\"module module-text tb_msnx200   \" data-lazy=\"1\">\n        <div  class=\"tb_text_wrap\">\n        <h3>Conference Organizers<\/h3>\n<ul>\n<li>John W. Fowler, Arizona State University, USA<\/li>\n<li>Young Jae Jang, KAIST, South Korea<\/li>\n<li>Lars M\u00f6nch, University of Hagen, Germany<\/li>\n<\/ul>\n<h3>International Program Committee<\/h3>\n<ul>\n<li>Jakey Blue, National Taiwan University, Taiwan<\/li>\n<li>Chen-Fu Chien, National Tsing-Hua University, Taiwan<\/li>\n<li>St\u00e9phane Dauz\u00e8re-P\u00e9r\u00e8s, Ecole des Mines de Saint-Etienne, France<\/li>\n<li>Hans Ehm, Infineon Technologies, Germany<\/li>\n<li>Ken Fordyce, Arkieva, USA<\/li>\n<li>Feng Ju, Arizona State University, USA<\/li>\n<li>Michael Hassoun, Ariel University, Israel<\/li>\n<li>Cathal Heavey, University of Limerick, Ireland<\/li>\n<li>Jesus Jimenez, Texas State University, USA<\/li>\n<li>Myoungsoo (Andy) Ham, Liberty University, USA<\/li>\n<li>Chiang Hsu, TSMC, Taiwan<\/li>\n<li>Young Jae Jang, KAIST, South Korea<\/li>\n<li>Baris Kacar, SAS, USA<\/li>\n<li>Adar Kalir, Intel, Israel<\/li>\n<li>DJ Kim, Micron Technology, USA<\/li>\n<li>Hyun-Jung Kim, KAIST, South Korea<\/li>\n<li>Andreas Klemmt, Infineon Technologies, Germany<\/li>\n<li>Douniel Lamghari-Idrissi, ASML, Netherlands<\/li>\n<li>Tae-Eog Lee, KAIST, South Korea<\/li>\n<li>Peter Lendermann, D-SIMLAB Technologies, Singapore<\/li>\n<li>Andrea Matta, POLITECNICO DI MILANO, Italy<\/li>\n<li>John Milne, Clarkson University, USA<\/li>\n<li>James Morrison, Central Michigan University, USA<\/li>\n<li>Tina O\u2019Donnell, Seagate Technology, Derry, United Kingdom<\/li>\n<li>Detlef Pabst, Global Foundries, USA<\/li>\n<li>Thomas Ponsignon, Infineon Technologies, Germany<\/li>\n<li>Oliver Rose, Universit\u00e4t der Bundeswehr M\u00fcnchen, Germany<\/li>\n<li>Ralf Sprenger, Infineon Technologies, Germany<\/li>\n<li>Marcel Stehli, Global Foundries, Germany<\/li>\n<li>Gian Antonio Susto, University of Padova, Italy<\/li>\n<li>Reha Uzsoy, North Carolina State University, USA<\/li>\n<li>Philippe Vialletelle, ST Microelectronics, France<\/li>\n<li>Cheng-Hung, National Taiwan University, Taiwan<\/li>\n<li>Jei-Zheng Wu, Soochow University Taipei, Taiwan<\/li>\n<li>Claude Yugma, Ecole de Mines de Saint-Etienne, France<\/li>\n<\/ul>    <\/div>\n<\/div>\n<!-- \/module text -->        <\/div>\n                    <div  data-lazy=\"1\" class=\"module_column tb-column col4-1 tb_uu2a146 last\">\n                    <!-- module text -->\n<div  class=\"module module-text tb_izyw532   \" data-lazy=\"1\">\n        <div  class=\"tb_text_wrap\">\n        <h2>Paper Submission<\/h2>\n<p>Please follow the <a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/authorsubmission\/\">2026 WSC Author Kit <\/a>to prepare your MASM 2026 Paper or Extended Abstract.<\/p>\n<h2>Important Dates<\/h2>\n<h3>Full Research Papers:<\/h3>\n<p><span style=\"color: #003087\"><strong>February 23, 2026:<\/strong> <\/span>Submission open<\/p>\n<p><span style=\"color: #003087\"><strong>April 5, 2026: <\/strong><\/span>Submissions due for Invited Papers\u00a0<\/p>\n<p><span style=\"color: #003087\"><strong>May 25, 2026:<\/strong><\/span> Notification of acceptance<\/p>\n<p><span style=\"color: #003087\"><strong>June 26, 2026:<\/strong> <\/span>Camera-ready paper due<\/p>\n<h3>Extended Abstracts for Industrial Case Studies:<\/h3>\n<p><span style=\"color: #003087\"><strong>May 5, 2026:<\/strong><\/span> Submission open for extended abstracts<\/p>\n<p><span style=\"color: #003087\"><b>July 31, 2026:<\/b> Submissions due <\/span><\/p>\n<p><span style=\"color: #003087\"><strong>August 31, 2026: <\/strong><\/span>Notification of Acceptance<\/p>\n<p><span style=\"color: #003087\"><strong>September 11, 2026:<\/strong><\/span> Camera-ready extended abstracts due<\/p>\n<p>\u00a0<\/p>    <\/div>\n<\/div>\n<!-- \/module text -->        <\/div>\n                        <\/div>\n        <\/div>\n                        <div  data-css_id=\"g9w1431\" data-lazy=\"1\" class=\"module_row themify_builder_row fullwidth_row_container tb_g9w1431 tf_w\">\n                        <div class=\"row_inner col_align_top tb_col_count_2 tf_box tf_rel\">\n                        <div  data-lazy=\"1\" class=\"module_column tb-column col3-2 tb_jmt4433 first\">\n                    <!-- module text -->\n<div  class=\"module module-text tb_cmhb366   \" data-lazy=\"1\">\n        <div  class=\"tb_text_wrap\">\n        <h3>MASM Keynote<\/h3>\n<p><strong>Dr. Chia-Yen Lee<\/strong> is currently a professor in the Department of Information Management, National Taiwan University. He received Ph.D. degree from the Dept. of Industrial and Systems Engineering at Texas A&amp;M University, USA. His research interests include productivity and efficiency analysis, manufacturing data science, intelligent manufacturing systems, and stochastic optimization with applications to semiconductor manufacturing, TFT-LCD, energy and pollutant, fastener, petrochemical industries, etc.<\/p>\n<p>He serves as associate editor for <em>IEEE Transactions on Semiconductor Manufacturing<\/em> and <em>IEEE Transactions on Automation Science and Engineering<\/em>. His research works appear in <em>European Journal of Operational Research<\/em>, <em>IEEE Transactions on Power Systems<\/em>, <em>IEEE Transactions on Engineering Management<\/em>, <em>Journal of Environmental Management<\/em>, and <em>Applied Soft Computing<\/em>, etc.<\/p>\n<p>He received the 2021 Outstanding Research Award from Ministry of Science and Technology (MOST) of Taiwan, the 2018 Kwoh-Ting Li Technology &amp; Literature Lectureships Award of Distinguished Young Scholars from NCKU-Delta Electronics, the 2017 Ta-You Wu Memorial Award of Distinguished Young Scholars from MOST, Outstanding Young Scholar Grants (2014, 2017, 2022) from MOST, the 17th Best Practice Paper Award from the Asia Pacific Industrial Engineering and Management Systems Conference (APIEMS 2016), the 2016 Outstanding Young Industrial Engineer Award from the Chinese Institute of Industrial Engineers (CIIE 2016). <\/p>    <\/div>\n<\/div>\n<!-- \/module text -->        <\/div>\n                    <div  data-lazy=\"1\" class=\"module_column tb-column col3-1 tb_70cf538 last\">\n                    <!-- module image -->\n<div  class=\"module module-image tb_jks0204 image-top   tf_mw\" data-lazy=\"1\">\n        <div class=\"image-wrap tf_rel tf_mw\">\n            <img loading=\"lazy\" decoding=\"async\" width=\"210\" height=\"256\" src=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2026\/02\/Chia-Yen-Lee.png\" class=\"wp-post-image wp-image-12261\" title=\"Chia-Yen Lee\" alt=\"Chia-Yen Lee\nProfessor, Department of Information Management\nTaiwan University\">    \n        <\/div>\n    <!-- \/image-wrap -->\n    \n        <div class=\"image-content\">\n                        <div class=\"image-caption tb_text_wrap\">\n            <strong>Chia-Yen Lee<\/strong><br \/>\n<strong>Professor, Department of Information Management<\/strong><br \/>\n<strong>Taiwan University<\/strong><br \/>        <\/div>\n        <!-- \/image-caption -->\n            <\/div>\n    <!-- \/image-content -->\n        <\/div>\n<!-- \/module image -->        <\/div>\n                        <\/div>\n        <\/div>\n        <\/div>\n<!--\/themify_builder_content-->","protected":false},"excerpt":{"rendered":"<p>22nd International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) Glasgow, ScotlandDecember 6-9, 2026Part of Simulation for Climate Resilience The International Conference on Modelling and Analysis of Semiconductor Manufacturing (MASM) is an annual forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world involved in modelling and [&hellip;]<\/p>\n","protected":false},"author":1001065,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"class_list":["post-4423","page","type-page","status-publish","hentry","has-post-title","has-post-date","has-post-category","has-post-tag","has-post-comment","has-post-author",""],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v26.0 (Yoast SEO v26.0) - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Modeling and Analysis of Semiconductor Manufacturing - Winter Simulation Conference 2026<\/title>\n<meta name=\"description\" content=\"The 2025 MASM is a forum for exchanging of ideas and industrial innovations in modeling and analysis of complex high-tech manufacturing systems.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Modeling and Analysis of Semiconductor Manufacturing\" \/>\n<meta property=\"og:description\" content=\"The 2025 MASM is a forum for exchanging of ideas and industrial innovations in modeling and analysis of complex high-tech manufacturing systems.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/\" \/>\n<meta property=\"og:site_name\" content=\"Winter Simulation Conference 2026\" \/>\n<meta property=\"article:modified_time\" content=\"2026-02-23T22:45:07+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2024\/01\/WSC_2024_Logo-1.png\" \/>\n\t<meta property=\"og:image:width\" content=\"300\" \/>\n\t<meta property=\"og:image:height\" content=\"315\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"12 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/\",\"url\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/\",\"name\":\"Modeling and Analysis of Semiconductor Manufacturing - Winter Simulation Conference 2026\",\"isPartOf\":{\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo-300x283.png\",\"datePublished\":\"2017-01-18T15:45:01+00:00\",\"dateModified\":\"2026-02-23T22:45:07+00:00\",\"description\":\"The 2025 MASM is a forum for exchanging of ideas and industrial innovations in modeling and analysis of complex high-tech manufacturing systems.\",\"breadcrumb\":{\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/#primaryimage\",\"url\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo.png\",\"contentUrl\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo.png\",\"width\":353,\"height\":333},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Modeling and Analysis of Semiconductor Manufacturing\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/#website\",\"url\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/\",\"name\":\"Winter Simulation Conference 2026\",\"description\":\"Simulation for Climate Resilience\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"}]}<\/script>\n<!-- \/ Yoast SEO Premium plugin. -->","yoast_head_json":{"title":"Modeling and Analysis of Semiconductor Manufacturing - Winter Simulation Conference 2026","description":"The 2025 MASM is a forum for exchanging of ideas and industrial innovations in modeling and analysis of complex high-tech manufacturing systems.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/","og_locale":"en_US","og_type":"article","og_title":"Modeling and Analysis of Semiconductor Manufacturing","og_description":"The 2025 MASM is a forum for exchanging of ideas and industrial innovations in modeling and analysis of complex high-tech manufacturing systems.","og_url":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/","og_site_name":"Winter Simulation Conference 2026","article_modified_time":"2026-02-23T22:45:07+00:00","og_image":[{"width":300,"height":315,"url":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2024\/01\/WSC_2024_Logo-1.png","type":"image\/png"}],"twitter_card":"summary_large_image","twitter_misc":{"Est. reading time":"12 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/","url":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/","name":"Modeling and Analysis of Semiconductor Manufacturing - Winter Simulation Conference 2026","isPartOf":{"@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/#website"},"primaryImageOfPage":{"@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/#primaryimage"},"image":{"@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/#primaryimage"},"thumbnailUrl":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo-300x283.png","datePublished":"2017-01-18T15:45:01+00:00","dateModified":"2026-02-23T22:45:07+00:00","description":"The 2025 MASM is a forum for exchanging of ideas and industrial innovations in modeling and analysis of complex high-tech manufacturing systems.","breadcrumb":{"@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/#primaryimage","url":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo.png","contentUrl":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo.png","width":353,"height":333},{"@type":"BreadcrumbList","@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/masm\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/"},{"@type":"ListItem","position":2,"name":"Modeling and Analysis of Semiconductor Manufacturing"}]},{"@type":"WebSite","@id":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/#website","url":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/","name":"Winter Simulation Conference 2026","description":"Simulation for Climate Resilience","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"}]}},"builder_content":"<h2><strong>22nd International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) <\/strong><\/h2> <p><strong>Glasgow, Scotland<br \/><\/strong><strong>December 6-9, 2026<br \/><\/strong><br \/><em>Part of<\/em><\/p> <p><a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo.png\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo-300x283.png\" alt=\"\" width=\"190\" height=\"179\" srcset=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo-300x283.png 300w, https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2025\/11\/Web_Color_WSC_2026_Logo.png 353w\" sizes=\"auto, (max-width: 190px) 100vw, 190px\" \/><\/a><\/p> <p><em><strong>Simulation for Climate Resilience<\/strong><\/em><\/p> <p>The International Conference on Modelling and Analysis of Semiconductor Manufacturing (MASM) is an annual forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world involved in modelling and analysis of complex high-tech manufacturing systems.<\/p> <p>The MASM Conference is fully contained within the Winter Simulation Conference (WSC), the world-leading conference for Discrete Event Simulation, but covers a much wider range of techniques and approaches that also include optimization, scheduling, queueing theory, process control, data analysis, artificial intelligence, and machine learning. It features a comprehensive program ranging from state-of-the-art research to recent case studies demonstrating the relevance of these techniques for Smart Manufacturing.<\/p> <p>For 2026 we are asking not just for Full Research Papers but also for relevant Industrial Case Studies illustrating the benefits that have been achieved with novel methodologies and solutions. These Industrial Case Study presentations will be fully integrated into the respective MASM application track but will only require a 3-page \u201cExtended Abstract\u201d and have shorter submission lead times to facilitate participation from the industry. Unlike Full Research Papers, Extended Abstracts will appear only in the INFORMS Simulation Society archives but not in the ACM and IEEE digital proceedings.<\/p> <p>We are looking for high-quality academic and applied research and relevant industrial case studies at all levels of Semiconductor Manufacturing.<\/p> <p>At the <strong>equipment and process level<\/strong>, we cover various aspects of Equipment Maintenance and Productivity, Quality and Advanced Process Control (Statistical Process Control, Fault Detection and Classification, Run To Run, Virtual Metrology, etc.), but also how to handle and exploit the huge amount of data generated in wafer fabs (Big Data). As such we also invite submissions from leading Semiconductor Equipment Manufacturers.<\/p> <p>At the <strong>shop-floor level<\/strong>, optimized WIP management, dispatching, scheduling and sampling of lots or qualification management of products on machines remain critical, in particular when handling complex constraints.<\/p> <p>At the <strong>factory level<\/strong>, it is important to develop efficient transportation and storage policies, production and capacity planning approaches, in order to reduce cycle times and time-to-market.<\/p> <p>At the <strong>strategic level<\/strong>, demand planning, factory economics and cost modelling, new product introduction, and supply chain efficiency are important topics to support the business.<\/p> <p>We invite participants to present on all topics related to modelling and analysis that will help address these challenges, including the human in-the-loop challenge. We also welcome contributions that integrate decisions or information at different decision levels which is becoming a must. These various goals will be attained through new advanced control and statistical methods, novel computing techniques, methods from artificial intelligence, and operations research methods.<\/p> <p>While the MASM Conference is mostly focused on the current semiconductor industry state-of-the-art, neither presenters nor attendees need to be in the IC industry to participate. We are interested in methodologies, research and\/or applications from other related industries such as TFT-LCD, flexible displays, bio-chip, solid state lighting (LED), and photovoltaic (PV) that might also share or want to share common and new practices. Interested individuals within academia, government agencies, equipment suppliers, manufacturers, students, contractors, and other interested parties are encouraged to participate.<\/p> <p>All attendees of the MASM Conference will register for Winter Simulation Conference at the same cost. In turn, all participants of WSC can attend the respective MASM sessions.<\/p> <p>Each accepted paper and case study presentation must have a separate, paid registration. Only under highly unusual circumstances, and at the discretion of the conference leadership, will an author be allowed to present more than one paper on a single registration. Authors wishing to do so must contact the Program Chair by September 1, clearly describing which papers the authors wish to present under the single registration, and why an exception to the conference policy is warranted. Unless permission is granted, an author planning to present two papers will be required to pay for two registrations.<\/p> <p>Authors of high-quality submissions of Full Research Papers will also have the opportunity to submit considerably extended versions of their MASM contributions to IEEE Transactions on Semiconductor Manufacturing.<\/p>\n<h3>Conference Organizers<\/h3> <ul> <li>John W. Fowler, Arizona State University, USA<\/li> <li>Young Jae Jang, KAIST, South Korea<\/li> <li>Lars M\u00f6nch, University of Hagen, Germany<\/li> <\/ul> <h3>International Program Committee<\/h3> <ul> <li>Jakey Blue, National Taiwan University, Taiwan<\/li> <li>Chen-Fu Chien, National Tsing-Hua University, Taiwan<\/li> <li>St\u00e9phane Dauz\u00e8re-P\u00e9r\u00e8s, Ecole des Mines de Saint-Etienne, France<\/li> <li>Hans Ehm, Infineon Technologies, Germany<\/li> <li>Ken Fordyce, Arkieva, USA<\/li> <li>Feng Ju, Arizona State University, USA<\/li> <li>Michael Hassoun, Ariel University, Israel<\/li> <li>Cathal Heavey, University of Limerick, Ireland<\/li> <li>Jesus Jimenez, Texas State University, USA<\/li> <li>Myoungsoo (Andy) Ham, Liberty University, USA<\/li> <li>Chiang Hsu, TSMC, Taiwan<\/li> <li>Young Jae Jang, KAIST, South Korea<\/li> <li>Baris Kacar, SAS, USA<\/li> <li>Adar Kalir, Intel, Israel<\/li> <li>DJ Kim, Micron Technology, USA<\/li> <li>Hyun-Jung Kim, KAIST, South Korea<\/li> <li>Andreas Klemmt, Infineon Technologies, Germany<\/li> <li>Douniel Lamghari-Idrissi, ASML, Netherlands<\/li> <li>Tae-Eog Lee, KAIST, South Korea<\/li> <li>Peter Lendermann, D-SIMLAB Technologies, Singapore<\/li> <li>Andrea Matta, POLITECNICO DI MILANO, Italy<\/li> <li>John Milne, Clarkson University, USA<\/li> <li>James Morrison, Central Michigan University, USA<\/li> <li>Tina O\u2019Donnell, Seagate Technology, Derry, United Kingdom<\/li> <li>Detlef Pabst, Global Foundries, USA<\/li> <li>Thomas Ponsignon, Infineon Technologies, Germany<\/li> <li>Oliver Rose, Universit\u00e4t der Bundeswehr M\u00fcnchen, Germany<\/li> <li>Ralf Sprenger, Infineon Technologies, Germany<\/li> <li>Marcel Stehli, Global Foundries, Germany<\/li> <li>Gian Antonio Susto, University of Padova, Italy<\/li> <li>Reha Uzsoy, North Carolina State University, USA<\/li> <li>Philippe Vialletelle, ST Microelectronics, France<\/li> <li>Cheng-Hung, National Taiwan University, Taiwan<\/li> <li>Jei-Zheng Wu, Soochow University Taipei, Taiwan<\/li> <li>Claude Yugma, Ecole de Mines de Saint-Etienne, France<\/li> <\/ul>\n<h2>Paper Submission<\/h2> <p>Please follow the <a href=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/authorsubmission\/\">2026 WSC Author Kit <\/a>to prepare your MASM 2026 Paper or Extended Abstract.<\/p> <h2>Important Dates<\/h2> <h3>Full Research Papers:<\/h3> <p><strong>February 23, 2026:<\/strong> Submission open<\/p> <p><strong>April 5, 2026: <\/strong>Submissions due for Invited Papers\u00a0<\/p> <p><strong>May 25, 2026:<\/strong> Notification of acceptance<\/p> <p><strong>June 26, 2026:<\/strong> Camera-ready paper due<\/p> <h3>Extended Abstracts for Industrial Case Studies:<\/h3> <p><strong>May 5, 2026:<\/strong> Submission open for extended abstracts<\/p> <p><b>July 31, 2026:<\/b> Submissions due <\/p> <p><strong>August 31, 2026: <\/strong>Notification of Acceptance<\/p> <p><strong>September 11, 2026:<\/strong> Camera-ready extended abstracts due<\/p> <p>\u00a0<\/p>\n<h3>MASM Keynote<\/h3> <p><strong>Dr. Chia-Yen Lee<\/strong> is currently a professor in the Department of Information Management, National Taiwan University. He received Ph.D. degree from the Dept. of Industrial and Systems Engineering at Texas A&amp;M University, USA. His research interests include productivity and efficiency analysis, manufacturing data science, intelligent manufacturing systems, and stochastic optimization with applications to semiconductor manufacturing, TFT-LCD, energy and pollutant, fastener, petrochemical industries, etc.<\/p> <p>He serves as associate editor for <em>IEEE Transactions on Semiconductor Manufacturing<\/em> and <em>IEEE Transactions on Automation Science and Engineering<\/em>. His research works appear in <em>European Journal of Operational Research<\/em>, <em>IEEE Transactions on Power Systems<\/em>, <em>IEEE Transactions on Engineering Management<\/em>, <em>Journal of Environmental Management<\/em>, and <em>Applied Soft Computing<\/em>, etc.<\/p> <p>He received the 2021 Outstanding Research Award from Ministry of Science and Technology (MOST) of Taiwan, the 2018 Kwoh-Ting Li Technology &amp; Literature Lectureships Award of Distinguished Young Scholars from NCKU-Delta Electronics, the 2017 Ta-You Wu Memorial Award of Distinguished Young Scholars from MOST, Outstanding Young Scholar Grants (2014, 2017, 2022) from MOST, the 17th Best Practice Paper Award from the Asia Pacific Industrial Engineering and Management Systems Conference (APIEMS 2016), the 2016 Outstanding Young Industrial Engineer Award from the Chinese Institute of Industrial Engineers (CIIE 2016). <\/p>\n<img src=\"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/files\/2026\/02\/Chia-Yen-Lee.png\" title=\"Chia-Yen Lee\" alt=\"Chia-Yen Lee Professor, Department of Information Management Taiwan University\"> <strong>Chia-Yen Lee<\/strong><br \/> <strong>Professor, Department of Information Management<\/strong><br \/> <strong>Taiwan University<\/strong><br \/>","_links":{"self":[{"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/wp-json\/wp\/v2\/pages\/4423","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/wp-json\/wp\/v2\/users\/1001065"}],"replies":[{"embeddable":true,"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/wp-json\/wp\/v2\/comments?post=4423"}],"version-history":[{"count":156,"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/wp-json\/wp\/v2\/pages\/4423\/revisions"}],"predecessor-version":[{"id":12264,"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/wp-json\/wp\/v2\/pages\/4423\/revisions\/12264"}],"wp:attachment":[{"href":"https:\/\/meetings.informs.org\/wordpress\/wsc2026\/wp-json\/wp\/v2\/media?parent=4423"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}