18th International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) 2022
December 11-14, 2022
The International Conference on Modelling and Analysis of Semiconductor Manufacturing (MASM) is an annual forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world involved in modelling and analysis of complex high-tech manufacturing systems.
The MASM Conference is fully contained within the Winter Simulation Conference (WSC), the world-leading conference for Discrete Event Simulation, but covers a much wider range of techniques and approaches that also include optimization, scheduling, queueing theory, process control, data analysis and machine learning. It features a comprehensive program ranging from state-of-the-art research to recent case studies demonstrating the relevance of these techniques for Smart Manufacturing.
For 2022 we are asking not just for Full Research Papers but also for relevant Industrial Case Studies illustrating the benefits that have been achieved with novel methodologies and solutions. These Industrial Case Study presentations will be fully integrated into the respective MASM application track but will only require a 2-page “Extended Abstract” and have shorter submission lead times to facilitate participation from the industry. Unlike Full Research Papers, Extended Abstracts will appear only in the INFORMS Simulation Society archives but not in the ACM and IEEE digital proceedings.
The MASM 2022 conference will take place in “Silicon Island” Singapore, one of the most dynamic and cosmopolitan cities in Asia, home to many players of the semiconductor and electronics supply chain, and in particular more than a dozen wafer fabrication facilities.
Uncertainties associated with the current pandemic situation will be considered and as such WSC/MASM 2022 will be organized in a fully hybrid mode, i.e. it will be possible to present papers and case studies either on-site in Singapore or virtually.
We are looking for high-quality academic and applied research and relevant industrial case studies at all levels of Semiconductor Manufacturing.
At the equipment and process level, we would like to cover various aspects of Equipment Maintenance and Productivity, Quality and Advanced Process Control (Statistical Process Control, Fault Detection and Classification, Run To Run, Virtual Metrology, etc.), but also how to handle and exploit the huge amount of data generated in wafer fabs (Big Data). As such we also invite submissions from leading Semiconductor Equipment Manufacturers.
At the shop-floor level, optimized WIP management, dispatching, scheduling and sampling of lots or qualification management of products on machines remain critical in particular when handling complex constraints.
At the factory level, it is important to develop efficient transportation and storage policies, production and capacity planning approaches, in order to reduce cycle times and time-to-market.
At the strategic level, demand planning, factory economics and cost modelling, new product introduction, and supply chain efficiency are important topics to support the business.
We invite participants to present on all topics related to modelling and analysis that will help address these challenges. We also welcome contributions that integrate decisions or information at different decision levels which is becoming a must. These various goals will be attained through new advanced control and statistical methods, novel computing techniques, methods from artificial intelligence, and operations research methods.
While the MASM Conference is mostly focused on the current semiconductor industry state-of-the-art, neither presenters nor attendees need to be in the IC industry to participate. We are interested in methodologies, research and/or applications from other related industries such as TFT-LCD, flexible displays, bio-chip, solid state lighting (LED), and photovoltaic (PV) that might also share or want to share common and new practices. Interested individuals within academia, government agencies, equipment suppliers, manufacturers, students, contractors, and other interested parties are encouraged to participate.
All attendees of the MASM Conference will register for Winter Simulation Conference at the same cost. In turn, all participants of WSC can attend the respective MASM sessions.
Each accepted paper and case study presentation must have a separate, paid registration. Only under highly unusual circumstances, and at the discretion of the conference leadership, will an author be allowed to present more than one paper on a single registration. Authors wishing to do so must contact the Program Chair by September 1, clearly describing which papers the authors wish to present under the single registration, and why an exception to the conference policy is warranted. Unless permission is granted, an author planning to present two papers will be required to pay for two registrations.
Authors of high-quality submissions of Full Research Papers will also have the opportunity to submit considerably extended versions of their MASM contributions to IEEE Transactions on Semiconductor Manufacturing.
Koen de Backer
Vice President Smart Manufacturing & Artificial Intelligence
Chairman, Smart Manufacturing Council, SEMI Southeast Asia
John W. Fowler, Arizona State University, USA
Lars Mönch, University of Hagen, Germany
Kan Wu, Chang Gung University, Taiwan
International Program Committee
Jakey Blue, National Taiwan University, Taiwan
Chen-Fu Chien, National Tsing-Hua University, Taiwan
Stéphane Dauzère-Pérès, Ecole des Mines de Saint-Etienne, France
Hans Ehm, Infineon Technologies, Germany
Ken Fordyce, Arkieva, USA
Michael Hassoun, Ariel University, Israel
Cathal Heavey, University of Limerick, Ireland
Jesus Jimenez, Texas State University, USA
Myoungsoo (Andy) Ham, Liberty University, USA
Chiang Hsu, TSMC, Taiwan
Baris Kacar, SAS, USA
Adar Kalir, Intel, Israel
DJ Kim, Micron Technology, USA
Hyun-Jung Kim, KAIST, Korea
Andreas Klemmt, Infineon Technologies, Germany
Tae-Eog Lee, KAIST, Korea
Peter Lendermann, D-SIMLAB Technologies, Singapore
John Milne, Clarkson University, USA
James Morrison, Central Michigan University, USA
Tina O’Donnell, Seagate Technology, Derry, United Kingdom
Detlef Pabst, Global Foundries, USA
Thomas Ponsignon, Infineon Technologies, Germany
Oliver Rose, Universität der Bundeswehr München, Germany
Ralf Sprenger, Infineon Technologies, Germany
Marcel Stehli, Global Foundries, Germany
Gian Antonio Susto, University of Padova, Italy
Reha Uzsoy, North Carolina State University, USA
Philippe Vialletelle, ST Microelectronics, France
Jei-Zheng Wu, Soochow University Taipei, Taiwan
Claude Yugma, Ecole de Mines de Saint-Etienne, France
Please follow the WSC 2022 Author Kit to prepare your MASM 2022 Paper or Extended Abstract.
Full Research Papers:
Immediately: Submission open
April 5, 2022: Submission due
April 26, 2022: Submission due for invited papers
May 31, 2022: Notification of acceptance
August 31, 2022: Camera-ready paper due
Extended Abstracts for Industrial Case Studies:
May 1, 2022: Submission open
August 2, 2022: Submission due
August 31, 2022: Notification of acceptance
September 13, 2022: Camera-ready abstract due